The production process for monocrystalline silicon wafer includes crystal pulling, square cutting, slicing, cleaning and sorting. Through continuous improvement of the cutting process and final inspection capability, the production capacity and silicon wafer yield rate have been continuously improved to meet customer demands for silicon wafer quality and output.
Main Products
Proven technology, equipment and production
Market proven, high customer satisfaction
Low degradation, high performance
Main Products
High-efficiency products
Customized, high-quality products
Continuous improvement of production lines
Main Products
Proven technology, equipment and production
Market proven, high customer satisfaction
Low degradation, high performance
Main Products
High-efficiency products
Customized, high-quality products
Continuous improvement of production lines
LONGi has significantly reduced the crystal-pulling cost through the use of new processes such as large charge, high pulling speed and multi-time crystal pulling, supporting equipment improvement technology, as well as the introduction of new materials and automatic control system.
Low-degradation Monocrystalline Through the improvement of the quality of monocrystalline silicon wafers and the optimization of the cell-side process, monocrystalline has basically solved the initial attenuation problem and disclosed this technology to the entire industry.
Materials Innovation The costs of non-silicon raw and auxiliary materials used in crystal pulling account for about 25% of the total cost. Prolonging the service life of non-silicon raw and auxiliary materials is an important way to reduce the crystal-pulling cost. Examples include carbon-carbon composite materials and crucible coating technology.
Automation and Intelligence Intelligent manufacturing can improve the effective production capacity, greatly reducing the number of workers and improving the consistency of the crystal growth process. Smart automation tools are used to control the single crystal furnace, reducing human intervention in the crystal growth process.
Advanced Wafer Slicing Advanced wafer slicing techniques can greatly improve the yield per kilogram of monocrystalline and the slicing capacity, contributing greatly to the value of the product and supporting ongoing cost reductions of monocrystalline and polycrystalline silicon wafers.
Low-degradation Monocrystalline Through the improvement of the quality of monocrystalline silicon wafers and the optimization of the cell-side process, monocrystalline has basically solved the initial attenuation problem and disclosed this technology to the entire industry.
Materials Innovation The costs of non-silicon raw and auxiliary materials used in crystal pulling account for about 25% of the total cost. Prolonging the service life of non-silicon raw and auxiliary materials is an important way to reduce the crystal-pulling cost. Examples include carbon-carbon composite materials and crucible coating technology.
Automation and Intelligence Intelligent manufacturing can improve the effective production capacity, greatly reducing the number of workers and improving the consistency of the crystal growth process. Smart automation tools are used to control the single crystal furnace, reducing human intervention in the crystal growth process.
Advanced Wafer Slicing Advanced wafer slicing techniques can greatly improve the yield per kilogram of monocrystalline and the slicing capacity, contributing greatly to the value of the product and supporting ongoing cost reductions of monocrystalline and polycrystalline silicon wafers.
LONGi provides professional consulting services, advanced production of single-crystal silicon wafers, and full life-cycle operation and maintenance capabilities.
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